跟读练习: Inside The Hidden Bottleneck In The AI Chip Boom - 通过视频学习英语口语
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AI is driving a global race for more computing power.
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But the pressure isn't just on the chips.
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It's also on what sits beneath them, the ICE substrate.
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Instantly we could deliver easily 20 -25 % more if we would have the capacity fast enough.
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Once an overlooked part of the semiconductor supply chain, substrates are now in hot demand and growing in value.
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The substrate and the entire technology around that will be the new road.
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Austrian technology company AT &S makes components most of us will never see, but increasingly rely on.
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It has two main businesses.
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Its microelectronics division makes IC substrates the high -tech base layers beneath advanced chip packages that carry power and data between processes,
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memory, and the circuit board.
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Its electronic solution division makes high -end printed circuit boards used in smartphones, cars, medical equipment, and other devices.
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Together, the two divisions generated nearly 1 .8 billion euros, about 2 .1 billion US,
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in revenue in the financial year ending March 2026.
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The company had been spending heavily on new factories and equipment, including this manufacturing complex in Kulim, Malaysia.
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CEO Michael Melton took me inside the clean room to see
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the little -known component playing a growing role in the AI
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hardware race this is an actual substrate for artificial intelligence systems actual generations
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so what you see on the surface are ten thousands of
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metal bumps dice these are the connection points for in the middle you see it for a processor
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and outside for memory and input
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and output devices you have contact points on the back surface as well
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and this is bound to a big pcb substrate here and here on the front surface you have the processors.
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So what does it do?
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It is a kind of a blood and nerve system.
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Blood system means it provides power, like the blood is providing oxygen and sugar to our cells.
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Here the substrate is providing electrical energy.
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Additionally, we are talking about very high communication speeds
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and that's the reason why all these things are so dense close together and this is what the substrate also is doing.
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It connects all the hundreds of thousands of information points to each other.
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As AI systems grow more powerful, substrates must handle more power, move more data and connect more components.
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That is changing their design.
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Are these substrates of the future getting bigger or smaller?
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They're getting significantly bigger.
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And the reason is we want to compress more
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and more processors on a small area and more
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and more memory you want to compress on a small area
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so that the communication speed is even more advanced than it is today.
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So in the future we will see substrates significantly bigger
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so more and more components will be embedded here in the middle
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and more and more information lines are necessary in the future.
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The shift is starting to show up in AT &S's results After returning to profit in three months to June 2026,
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the company forecasts revenue growth of 45 % to 55 % for the financial year ending March 2027,
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with demand moving much faster than new production capacity.
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Are you producing enough to meet AI demand?
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How much more do you have to ramp up capacity?
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Instantly, we could deliver easily 20%, 25 % more if we would have a capacity fast enough.
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But we're actually ramping capacity.
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We are doing it here in Kulim as well as in China.
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But we're also ramping in Europe, in Austria.
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So Austria is a special spot.
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It's not the biggest one, but it's a spot where we do also R &D, where we have dedicated R &D production lines, what is unique in our industry.
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A couple of years ago, the substrates market was under a lot of pressure because of overcapacity.
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Now it's moving in the opposite direction.
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Is substrates now becoming the biggest hidden bottleneck in the AI race?
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Yeah, definitely.
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The development of computer chips was so fast.
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They are so fast now in their calculation procedures.
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Also in the calculation procedures between these GPUs and CPUs, communication to memory.
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that the communication speed, what is delivered by a substrate, is the limiting factor.
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So innovation… is taking part in the substrate area.
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So substrates are enabling better performance of AI centers in the future
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and therefore there's a lot of work actually done in innovation and substrates making them bigger.
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So bigger means more chips on the same substrate,
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better intermediate communication between all the components and this is significantly enhancing the performance of AI calculation centers.
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Is substrates becoming the new gold in the semiconductor business?
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Yeah this is most probably the case.
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Communication between the components becomes key and this is the substrate.
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So the substrate and the entire technology around that, so how to bring components together,
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this is what counts and there's a lot of money and value in this kind of a contribution.
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So yes it will be the new gold.
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Are your customers willing to pay such a big premium for your advanced substrates yes they do um
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and they're not complaining they they know why
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because we are co -developing most of the things
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so our customers are deeply involved in the technology
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and the technology challenges and the progress so
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if you have new computer chip designs
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and multiple chiplets on the same substrate of course it has to be a co -development with your customer
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and the value add from this enhanced communication speed
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and this better energy transport towards the chips is definitely worth the money and this is how our customers see it.
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Geopolitics has also pushed up the prices of your raw materials like gold, copper, polymass.
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Is that eating into your margins?
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Are you able to fully pass it on to your customers?
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I think there's a broad understanding in our industry that it has to be passed along the entire value chain.
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So we are in a very close contact to our suppliers as well to our customers
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and the entire industry understands that this has to be distributed along the value chain.
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Otherwise, the industry would break down.
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On the other hand, the value add of the new possibilities of artificial intelligence is worth this price increase.
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So that's not the biggest discussion.
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The big discussion is improvement in technology, improvement in yields, and just to be faster.
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in 2021 the company announced plans to invest up to 1
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.7 billion euros in the coulomb manufacturing complex in june 2026
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it announced plans for a further 1 .5 billion to 2
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billion euros of expansion here 18s says long -term customer commitment
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will support the investment your coulomb operations started out with just one big customer, U .S chip giant AMD.
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How much of your decision to set up a facility here in Malaysia is
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because of the pressure from your customers that you face to diversify outside of China?
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The pressure was high and for good reasons.
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So you need this kind of diversification, not just for political reasons, but also for disaster recovery, for example.
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So to have just one side, what fits it all, It causes a risk for the global economy at the end.
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So having a second big foot in the door here in Malaysia is not just good for the initial customer AMD, it will be good for a bunch of other customers.
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So what we're actually planning is, if we further build out Malaysia, we will host approximately five of the big customers, the well -known customers in the world.
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Unfortunately, I take it in advance, I can't tell you the names.
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And speaking of names, I need to press you on that, of course.
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AMD is a major tier one customer.
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What does your list of big name customers look like?
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Do they include the hyperscalers, the EV makers?
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Yes, it includes the hyperscalers as well as the makers and the producers of computer chips itself.
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So all the big names you know from the Silicon Valley are our customers.
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So we're talking about Intel, Microsoft, Amazon, Google, Tesla.
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You put the names on the table, so I can't comment on it.
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But most of the big names are definitely our customers.
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And with most of the big names, we are actually in the progress of defining and developing the future products.
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Customers is one thing.
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You're also working with partners like TSMC, MCOR.
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They are setting up facilities in Arizona under the US CHIPS Act.
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Is this something AT &S is also considering and exploring because you're part of the broader supply chain?
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So actually, we have a lot of customers in the United States.
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So far we are focusing in operations on the big plants we have
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and the reason is our processes are different from those of the companies you named
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and also from those of some of the chip manufacturers.
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So our substrates are bigger, we have wet chemical processes and we need still a lot of employees.
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And this is both from the availability and from the educational side.
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This is easier in countries like Malaysia but still also in China.
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So there is no direct plan now.
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to do something in the u .s
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but substrates are only part of the atns story its electronic solution division
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which makes high -end printed circuit boards account for roughly half of group revenue in the financial year ending march 2026.
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atns is up against pcb players including taiwan's compact and unimicron
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and us -based ttm technologies the substrate market is dominated by established Asian players,
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including Taiwan's Unimicron, Japan's EBITDA and Shinko Electric, and South Korea's Samsung Electromechanics.
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I asked CEO Michael Merton where AT &S believes it can win.
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Do you think AT &S has what it takes to become number one?
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Definitely it will be a journey, but the potential to stay one of the leading companies
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and to become one of the absolute dominant players is there
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and the reason is we are not the biggest one today we are not financially the strongest one today
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but we have capabilities which are extraordinary we have the capabilities of both sides
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which are necessary for the future this is advanced pcd and substrates
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and as we discuss the road maps down the way with
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our customers both of these competencies will be used in the future.
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You're a physicist by training, engineer at heart.
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You're running a critical player in a global semiconductor supply chain.
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With the industry moving this fast, what kind of leader is being demanded of you right now?
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Of course, it's helping a lot that I'm an engineer physicist.
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So to understand all the processes going on, you can't be cheated in certain terms of innovation and capabilities.
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This, of course, is great to understand what the company is doing in detail.
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On the other hand, it's also to provide a vision for the future of the company to the employees.
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So they need a target, they need to be envisioned to the best performance.
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So organizational development, implementation of innovation in the spirit of an entire company, this is absolutely key.
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At AT &S you employ thousands of workers at a time
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when AI is reshaping innovation
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and the industry how do you balance innovation with concerns about
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job security we're already using artificial intelligence in our operations for
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better determination of processes for improvement for quality insurance this is
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supporting the entire growth this is not a threat for the people
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which are employed today can you do with less people
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because of ai you can do more with the same amount of people that's the difference really
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so you think the opposite yeah It will definitely help to stay with your employees
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and to define not just our future as a company, but also their future.
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It's also about education.
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So we have an educational program for all employees worldwide to educate them in artificial intelligence usage.
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We want to have all employees using AI systems to improve their work.
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What's the biggest leadership lesson you've learned in your career that you take with you today as CEO of AT &S?
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So first of all, you're never fast enough.
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There were many people telling me, Michael, you are so fast.
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You're maybe too fast.
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Looking back, I would say, no, you are never too fast.
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And most organizations, most employees are more capable than management is expecting it.
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So they can have, not talking just about workload, I'm talking about changes, I'm talking about innovation, I'm talking about creativism, further development of their job profile.
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The second one is strategy alone is nice, but strategy has to go hand in hand with execution.
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And that means with organizational development.
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So organization enables strategy and strategy enables organization.
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But just to run a strategy without taking governance systems and organizational development also into account will fail.
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So this is my second biggest loan.
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As CEO of AT &S, what is your ultimate ambition for the company?
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Where do you see the group three to five years from now?
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Leading an advanced innovation for the entire communication infrastructure of not just artificial intelligence,
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for advanced automation, robotics, space technology and communication.
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Do you want to be the most profitable?
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I think this will go hand in hand, yes.
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Dr. Merton, thank you so much for talking to me.
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Thank you very much.
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Thank you.
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本课的词汇与口语要点
这段视频共有 182 个句子、2240 个单词可供跟读。 讲话部分时长为 14:43。 说话人语速自然，每分钟约 152 个词，接近日常对话。 85% 的单词属于英语最常用的 3,000 词，其余的词建议在练习前先学一下。
视频中的重点词汇
视频中 15 个值得学习的单词，附发音和释义：
| 单词 | 发音 | 释义 |
|---|---|---|
| substrate 名词 | /ˈsʌbˌstɹeɪt/ | 底層語言 /底层语言 |
| chip 名词 | /t͡ʃɪp/ | 筹码 |
| innovation 名词 | /ˌɪn.əˈveɪ.ʃən/ | 革新, 創新 /创新 |
| component 名词 | /kəmˈpoʊ.nənt/ | 元件, 部件 |
| artificial 形容词 | /ˌɑː.tɪˈfɪʃ.əl/ | 人造的 |
| euro 名词 | /ˈjʊɹoʊ/ | 歐元 /欧元 |
| organizational 形容词 | /ˌɔː(ɹ)ɡənɪˈzeɪʃənəl/ | 組織的 /组织的 |
| calculation 名词 | /ˌkælkjuˈleɪʃn̩/ | 計算 /计算 |
| semiconductor 名词 | /ˌsɛmikənˈdʌktə/ | 半導體 /半导体 |
| procedure 名词 | /pɹəˈsiː.d͡ʒə/ | 做法, 方法 |
| connect 动词 | /kəˈnɛkt/ | 連接 /连接 |
| define 动词 | /dɪˈfaɪn/ | 界定 |
| instantly 副词 | /ˈɪnstəntli/ | 立即 |
| maker 名词 | /ˈmeɪk.ɚ/ | 製造者 /制造者 |
| enhance 动词 | /ɪnˈhæns/ | 改善 |
视频中出现的短语动词
| 单词 | 释义 |
|---|---|
| break down 动词 | 壞了 /坏了, 出故障 |
| look back 动词 | 回顧 /回顾 |
视频中的语法
说话人最常用的结构，并附上视频中的原话：
| 结构 | 视频中的用法 |
|---|---|
| 被动语态 be + 过去分词 — 强调发生了什么，而不是谁做的 | is bound · will be embedded · is delivered |
| 现在完成时 have/has + 过去分词 — 过去发生但与现在仍有关联的事 | have dedicated · has also pushed · you've learned |
需要注意的发音
说话人用了 22 次缩略和弱读形式，例如 you're, we're, I'm。请按听到的简短形式来说。
- “sh” 和 “zh” 音: innovation /ˌɪn.əˈveɪ.ʃən/, artificial /ˌɑː.tɪˈfɪʃ.əl/, organizational /ˌɔː(ɹ)ɡənɪˈzeɪʃənəl/, calculation /ˌkælkjuˈleɪʃn̩/, contribution /ˌkɑntɹɪˈbjuʃən/
- 长单词——注意重音位置: innovation /ˌɪn.əˈveɪ.ʃən/, artificial /ˌɑː.tɪˈfɪʃ.əl/, capability /ˌkeɪ.pəˈbɪl.ɪ.ti/, organizational /ˌɔː(ɹ)ɡənɪˈzeɪʃənəl/, semiconductor /ˌsɛmikənˈdʌktə/
如何用这段视频练习
- 先完整听一遍视频，不要开口，记下不认识的单词。
- 先用 0.75 倍速逐句跟读，熟练之后再回到正常速度。
- 录下自己的声音并与原声对比，特别注意 substrate, chip, innovation 这类单词。
什么是跟读法？
跟读法 (Shadowing) 是一种有科学依据的语言学习技巧，最初开发用于专业口译员的培训，并由多语言者Alexander Arguelles博士普及。这个方法简单而强大：您在听英语母语原声的同时立即大声重复——就像是一个延迟1-2秒紧跟说话者的影子。与被动听力或语法练习不同，跟读法强迫您的大脑和口腔肌肉同时处理并模仿真实的讲话模式。研究表明它能显着提高发音准确性，语调，节奏，连读，听力理解和口语流利度——使其成为雅思口语备考和真实英语交流最有效的方法之一。