ฝึกพูดภาษาอังกฤษด้วยเทคนิค Shadowing จากวิดีโอ: Inside The Hidden Bottleneck In The AI Chip Boom

AI is driving a global race for more computing power.

But the pressure isn't just on the chips.

It's also on what sits beneath them, the ICE substrate.

Instantly we could deliver easily 20 -25 % more if we would have the capacity fast enough.

Once an overlooked part of the semiconductor supply chain, substrates are now in hot demand and growing in value.

The substrate and the entire technology around that will be the new road.

Austrian technology company AT &S makes components most of us will never see, but increasingly rely on.

It has two main businesses.

Its microelectronics division makes IC substrates the high -tech base layers beneath advanced chip packages that carry power and data between processes,

memory, and the circuit board.

Its electronic solution division makes high -end printed circuit boards used in smartphones, cars, medical equipment, and other devices.

Together, the two divisions generated nearly 1 .8 billion euros, about 2 .1 billion US,

in revenue in the financial year ending March 2026.

The company had been spending heavily on new factories and equipment, including this manufacturing complex in Kulim, Malaysia.

CEO Michael Melton took me inside the clean room to see

the little -known component playing a growing role in the AI

hardware race this is an actual substrate for artificial intelligence systems actual generations

so what you see on the surface are ten thousands of

metal bumps dice these are the connection points for in the middle you see it for a processor

and outside for memory and input

and output devices you have contact points on the back surface as well

and this is bound to a big pcb substrate here and here on the front surface you have the processors.

So what does it do?

It is a kind of a blood and nerve system.

Blood system means it provides power, like the blood is providing oxygen and sugar to our cells.

Here the substrate is providing electrical energy.

Additionally, we are talking about very high communication speeds

and that's the reason why all these things are so dense close together and this is what the substrate also is doing.

It connects all the hundreds of thousands of information points to each other.

As AI systems grow more powerful, substrates must handle more power, move more data and connect more components.

That is changing their design.

Are these substrates of the future getting bigger or smaller?

They're getting significantly bigger.

And the reason is we want to compress more

and more processors on a small area and more

and more memory you want to compress on a small area

so that the communication speed is even more advanced than it is today.

So in the future we will see substrates significantly bigger

so more and more components will be embedded here in the middle

and more and more information lines are necessary in the future.

The shift is starting to show up in AT &S's results After returning to profit in three months to June 2026,

the company forecasts revenue growth of 45 % to 55 % for the financial year ending March 2027,

with demand moving much faster than new production capacity.

Are you producing enough to meet AI demand?

How much more do you have to ramp up capacity?

Instantly, we could deliver easily 20%, 25 % more if we would have a capacity fast enough.

But we're actually ramping capacity.

We are doing it here in Kulim as well as in China.

But we're also ramping in Europe, in Austria.

So Austria is a special spot.

It's not the biggest one, but it's a spot where we do also R &D, where we have dedicated R &D production lines, what is unique in our industry.

A couple of years ago, the substrates market was under a lot of pressure because of overcapacity.

Now it's moving in the opposite direction.

Is substrates now becoming the biggest hidden bottleneck in the AI race?

Yeah, definitely.

The development of computer chips was so fast.

They are so fast now in their calculation procedures.

Also in the calculation procedures between these GPUs and CPUs, communication to memory.

that the communication speed, what is delivered by a substrate, is the limiting factor.

So innovation… is taking part in the substrate area.

So substrates are enabling better performance of AI centers in the future

and therefore there's a lot of work actually done in innovation and substrates making them bigger.

So bigger means more chips on the same substrate,

better intermediate communication between all the components and this is significantly enhancing the performance of AI calculation centers.

Is substrates becoming the new gold in the semiconductor business?

Yeah this is most probably the case.

Communication between the components becomes key and this is the substrate.

So the substrate and the entire technology around that, so how to bring components together,

this is what counts and there's a lot of money and value in this kind of a contribution.

So yes it will be the new gold.

Are your customers willing to pay such a big premium for your advanced substrates yes they do um

and they're not complaining they they know why

because we are co -developing most of the things

so our customers are deeply involved in the technology

and the technology challenges and the progress so

if you have new computer chip designs

and multiple chiplets on the same substrate of course it has to be a co -development with your customer

and the value add from this enhanced communication speed

and this better energy transport towards the chips is definitely worth the money and this is how our customers see it.

Geopolitics has also pushed up the prices of your raw materials like gold, copper, polymass.

Is that eating into your margins?

Are you able to fully pass it on to your customers?

I think there's a broad understanding in our industry that it has to be passed along the entire value chain.

So we are in a very close contact to our suppliers as well to our customers

and the entire industry understands that this has to be distributed along the value chain.

Otherwise, the industry would break down.

On the other hand, the value add of the new possibilities of artificial intelligence is worth this price increase.

So that's not the biggest discussion.

The big discussion is improvement in technology, improvement in yields, and just to be faster.

in 2021 the company announced plans to invest up to 1

.7 billion euros in the coulomb manufacturing complex in june 2026

it announced plans for a further 1 .5 billion to 2

billion euros of expansion here 18s says long -term customer commitment

will support the investment your coulomb operations started out with just one big customer, U .S chip giant AMD.

How much of your decision to set up a facility here in Malaysia is

because of the pressure from your customers that you face to diversify outside of China?

The pressure was high and for good reasons.

So you need this kind of diversification, not just for political reasons, but also for disaster recovery, for example.

So to have just one side, what fits it all, It causes a risk for the global economy at the end.

100

So having a second big foot in the door here in Malaysia is not just good for the initial customer AMD, it will be good for a bunch of other customers.

101

So what we're actually planning is, if we further build out Malaysia, we will host approximately five of the big customers, the well -known customers in the world.

102

Unfortunately, I take it in advance, I can't tell you the names.

103

And speaking of names, I need to press you on that, of course.

104

AMD is a major tier one customer.

105

What does your list of big name customers look like?

106

Do they include the hyperscalers, the EV makers?

107

Yes, it includes the hyperscalers as well as the makers and the producers of computer chips itself.

108

So all the big names you know from the Silicon Valley are our customers.

109

So we're talking about Intel, Microsoft, Amazon, Google, Tesla.

110

You put the names on the table, so I can't comment on it.

111

But most of the big names are definitely our customers.

112

And with most of the big names, we are actually in the progress of defining and developing the future products.

113

Customers is one thing.

114

You're also working with partners like TSMC, MCOR.

115

They are setting up facilities in Arizona under the US CHIPS Act.

116

Is this something AT &S is also considering and exploring because you're part of the broader supply chain?

117

So actually, we have a lot of customers in the United States.

118

So far we are focusing in operations on the big plants we have

119

and the reason is our processes are different from those of the companies you named

120

and also from those of some of the chip manufacturers.

121

So our substrates are bigger, we have wet chemical processes and we need still a lot of employees.

122

And this is both from the availability and from the educational side.

123

This is easier in countries like Malaysia but still also in China.

124

So there is no direct plan now.

125

to do something in the u .s

126

but substrates are only part of the atns story its electronic solution division

127

which makes high -end printed circuit boards account for roughly half of group revenue in the financial year ending march 2026.

128

atns is up against pcb players including taiwan's compact and unimicron

129

and us -based ttm technologies the substrate market is dominated by established Asian players,

130

including Taiwan's Unimicron, Japan's EBITDA and Shinko Electric, and South Korea's Samsung Electromechanics.

131

I asked CEO Michael Merton where AT &S believes it can win.

132

Do you think AT &S has what it takes to become number one?

133

Definitely it will be a journey, but the potential to stay one of the leading companies

134

and to become one of the absolute dominant players is there

135

and the reason is we are not the biggest one today we are not financially the strongest one today

136

but we have capabilities which are extraordinary we have the capabilities of both sides

137

which are necessary for the future this is advanced pcd and substrates

138

and as we discuss the road maps down the way with

139

our customers both of these competencies will be used in the future.

140

You're a physicist by training, engineer at heart.

141

You're running a critical player in a global semiconductor supply chain.

142

With the industry moving this fast, what kind of leader is being demanded of you right now?

143

Of course, it's helping a lot that I'm an engineer physicist.

144

So to understand all the processes going on, you can't be cheated in certain terms of innovation and capabilities.

145

This, of course, is great to understand what the company is doing in detail.

146

On the other hand, it's also to provide a vision for the future of the company to the employees.

147

So they need a target, they need to be envisioned to the best performance.

148

So organizational development, implementation of innovation in the spirit of an entire company, this is absolutely key.

149

At AT &S you employ thousands of workers at a time

150

when AI is reshaping innovation

151

and the industry how do you balance innovation with concerns about

152

job security we're already using artificial intelligence in our operations for

153

better determination of processes for improvement for quality insurance this is

154

supporting the entire growth this is not a threat for the people

155

which are employed today can you do with less people

156

because of ai you can do more with the same amount of people that's the difference really

157

so you think the opposite yeah It will definitely help to stay with your employees

158

and to define not just our future as a company, but also their future.

159

It's also about education.

160

So we have an educational program for all employees worldwide to educate them in artificial intelligence usage.

161

We want to have all employees using AI systems to improve their work.

162

What's the biggest leadership lesson you've learned in your career that you take with you today as CEO of AT &S?

163

So first of all, you're never fast enough.

164

There were many people telling me, Michael, you are so fast.

165

You're maybe too fast.

166

Looking back, I would say, no, you are never too fast.

167

And most organizations, most employees are more capable than management is expecting it.

168

So they can have, not talking just about workload, I'm talking about changes, I'm talking about innovation, I'm talking about creativism, further development of their job profile.

169

The second one is strategy alone is nice, but strategy has to go hand in hand with execution.

170

And that means with organizational development.

171

So organization enables strategy and strategy enables organization.

172

But just to run a strategy without taking governance systems and organizational development also into account will fail.

173

So this is my second biggest loan.

174

As CEO of AT &S, what is your ultimate ambition for the company?

175

Where do you see the group three to five years from now?

176

Leading an advanced innovation for the entire communication infrastructure of not just artificial intelligence,

177

for advanced automation, robotics, space technology and communication.

178

Do you want to be the most profitable?

179

I think this will go hand in hand, yes.

180

Dr. Merton, thank you so much for talking to me.

181

Thank you very much.

182

Thank you.

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คำศัพท์และข้อสังเกตด้านการพูดสำหรับบทเรียนนี้

วิดีโอนี้มี 182 ประโยค และ 2240 คำ สำหรับฝึกพูดตาม ช่วงที่มีเสียงพูดยาว 14:43 ผู้พูดพูดด้วยความเร็วเป็นธรรมชาติ ประมาณ 152 คำต่อนาที ใกล้เคียงกับบทสนทนาในชีวิตประจำวัน 85% ของคำอยู่ใน 3,000 คำที่ใช้บ่อยที่สุดในภาษาอังกฤษ ส่วนที่เหลือควรดูไว้ก่อนเริ่มฝึก

คำศัพท์สำคัญในวิดีโอนี้

คำที่ควรเรียนรู้ 15 คำจากวิดีโอ พร้อมคำอ่านและความหมาย:

คำศัพท์	คำอ่าน	ความหมาย
innovation คำนาม	/ˌɪn.əˈveɪ.ʃən/	นวัตกรรม
artificial คำคุณศัพท์	/ˌɑː.tɪˈfɪʃ.əl/	เทียม
euro คำนาม	/ˈjʊɹoʊ/	ยูโร
calculation คำนาม	/ˌkælkjuˈleɪʃn̩/	การคำนวณ
semiconductor คำนาม	/ˌsɛmikənˈdʌktə/	สารกึ่งตัวนำ
procedure คำนาม	/pɹəˈsiː.d͡ʒə/	วิธี, กรรมวิธี
connect คำกริยา	/kəˈnɛkt/	เชื่อม, ต่อ
instantly คำกริยาวิเศษณ์	/ˈɪnstəntli/	ทันที
employ คำกริยา	/ɪmˈplɔɪ/	จ้าง
lesson คำนาม	/ˈlɛs.ən/	บทเรียน
infrastructure คำนาม	/ˈɪnfɹəˌstɹʌkt͡ʃə/	โครงสร้างพื้นฐาน
package คำนาม	/ˈpæk.ɪd͡ʒ/	หีบห่อ, ห่อ
producer คำนาม	/pɹəˈdjuːsə/	ผู้ผลิต
output คำนาม	/ˈaʊtpʊt/	เอาท์พุต
layer คำนาม	/ˈleɪ̯ɚ/	ชั้น

ไวยากรณ์ในวิดีโอนี้

โครงสร้างที่ผู้พูดใช้บ่อยที่สุด พร้อมคำพูดจริงจากวิดีโอ:

โครงสร้าง	ในวิดีโอ
Passive voice be + กริยาช่อง 3 — เน้นสิ่งที่เกิดขึ้น ไม่ใช่ผู้กระทำ	is bound · will be embedded · is delivered
Present perfect have/has + กริยาช่อง 3 — เหตุการณ์ในอดีตที่ยังเกี่ยวข้องกับปัจจุบัน	have dedicated · has also pushed · you've learned

การออกเสียงที่ควรระวัง

ผู้พูดใช้รูปย่อและรูปลดเสียง 22 ครั้ง เช่น you're, we're, I'm ให้พูดแบบสั้นตามที่ได้ยิน

เสียง “sh” และ “zh”: innovation /ˌɪn.əˈveɪ.ʃən/, artificial /ˌɑː.tɪˈfɪʃ.əl/, organizational /ˌɔː(ɹ)ɡənɪˈzeɪʃənəl/, calculation /ˌkælkjuˈleɪʃn̩/, contribution /ˌkɑntɹɪˈbjuʃən/
คำยาว — ลงเสียงหนักให้ถูกพยางค์: innovation /ˌɪn.əˈveɪ.ʃən/, artificial /ˌɑː.tɪˈfɪʃ.əl/, capability /ˌkeɪ.pəˈbɪl.ɪ.ti/, organizational /ˌɔː(ɹ)ɡənɪˈzeɪʃənəl/, semiconductor /ˌsɛmikənˈdʌktə/

วิธีฝึกกับวิดีโอนี้

ฟังวิดีโอให้จบหนึ่งรอบโดยยังไม่ต้องพูด แล้วจดคำที่ยังไม่รู้จัก
เริ่มที่ความเร็ว 0.75× พูดตามทีละประโยค แล้วกลับไปใช้ความเร็วปกติเมื่อเริ่มคล่อง
อัดเสียงตัวเองแล้วเทียบกับต้นฉบับ โดยสังเกตคำอย่าง innovation, artificial, euro เป็นพิเศษ

เทคนิค Shadowing คืออะไร?

Shadowing เป็นเทคนิคการเรียนรู้ภาษาที่ได้รับการรับรองทางวิทยาศาสตร์ พัฒนาขึ้นสำหรับการฝึกนักแปลมืออาชีพ วิธีการนี้เรียบง่ายแต่ทรงพลัง: คุณฟังเสียงภาษาอังกฤษจากเจ้าของภาษาและพูดตามทันที — เหมือนเงาที่ตามผู้พูดด้วยช่วงเวลาห่าง 1-2 วินาที การวิจัยแสดงว่าเทคนิคนี้ปรับปรุงความแม่นยำในการออกเสียง ทำนองเสียง จังหวะ การเชื่อมเสียง การฟังเข้าใจ และความคล่องแคล่วในการพูดได้อย่างมีนัยสำคัญ

เทคนิค shadowing: อ่านคู่มือฉบับเต็มทีละขั้นตอน →

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ไวยากรณ์ในวิดีโอนี้

การออกเสียงที่ควรระวัง

วิธีฝึกกับวิดีโอนี้

เทคนิค Shadowing คืออะไร?