쉐도잉 연습: What is SMT (Surface Mount Technology)? PCB Assembly (Part 1) - 영상으로 영어 말하기 배우기
레슨 만드는 중...
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Music Welcome to the next video in the series of PCBs.
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Here we're going to be looking at what is an SMT.
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So using a surface mount technology to assemble PCBs Part 1.
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Surface Mount Technology Overview.
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Now, Surface Mount Technology, which is the SMT, is a method for producing electrical circuits in which the components are mounted
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or placed directly onto the surface of printed circuit boards or PCBs.
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An electrical device that is soldered to the PCB is called a Surface Mount Device or an SMD for short.
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By employing SMT, the production process speeds up
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but the risk of defects also increases due to the component miniaturization and to the denser packing of boards.
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In these conditions, detection of failures has become critical for any SMT manufacturing process.
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Let's have a look at the PCBA production process.
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So manufacturing PCBs with SMA techniques.
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Manufacturing of printed circuit boards with an automated surface mount assembly,
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or SMA line, consists of the following sequence of operations.
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Solder paste application Component placement reflow soldering, cleaning and electrical test In this video,
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we will concentrate on the first two steps in this process.
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So we'll look at preassembly steps.
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So the PCB design and manufacture.
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Once the PCB has been designed and the components selected, it is time to get the PCB produced and the components ordered.
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PCBs that are populated on a serviceman assembly line are normally produced in panel formats, as shown on the right hand side here.
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The SMDs come packaged in different methods from trays for larger components and on tape bound on a reel for smaller components.
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All the SMDs need to be sourced and made ready to load into the manufacturing line machines.
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SodaPaste application Let's have a look at the solder paste application process.
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So once the PCB is loaded into the machine, the stencil is positioned over the panels.
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Solder paste is then added in front of the squeegee.
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Let's have a look at that in a diagram format.
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So we can see here the stencil is lowered onto the PCB, the squeegee is in position,
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and the solder paste loaded just before the squeegee.
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The squeegee lowers onto the stencil such that it is applying a very specific amount of pressure.
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The squeegee moves along the length of the stencil while the solder paste is deposited into the stencil apertures.
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And you can see that in this image here,
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where the squeegee has completed its journey and left the solder deposits in the stencil apertures.
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At the end of the travel, the squeegee raises up and the stencil is separated from the panels.
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That is depicted here in this image.
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You can see the stencil is raised leaving the soda paste on the correct positions on the pads.
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Solder paste issues.
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So this first one is the acceptable deposit onto a pad.
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This is what it should be looking like.
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Some of the issues that could follow are: Slumped deposit of solder paste onto the pad, which just looks like it's just dumped on.
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Scavenged deposits of solder, and this is where the middle has been scooped out, and you can see that here.
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Ridging is where a solid paste is connected between Two pads.
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The last one we're going to look at is peaking or dog ears effect.
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And you can see that depicted here.
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So component placement process Let's have a look at that in the PCB design and manufacture.
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So basic placement sequence generally includes board indexing,
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board registration, fiducial vision alignment, component pickup component centering or vision inspection,
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component placement and board indexing, and automated optical inspection, Component pickup.
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component centering and vision inspection, component placement are repeated for each component.
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And you can see an example of a component placed on the wet soda pads here.
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Thank you.
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Let's have a look at PCB positioning.
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and the PCB positioning method.
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Through the process of board indexing, The PCP is loaded to the appropriate position.
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Fiducial marks provide common measurable points for all steps in the assembly process.
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The three main types of fiduciary marks are: 1.
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Panel.
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This is a global fiducial mark on a multiple printed circuit board fabrication panel
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that are located outside the parameters of the end product printed circuit boards.
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You can see an example of that here.
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2. Global.
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These are fiduciary marks used to locate the position of all the features on an individual printed circuit port.
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Again, this is shown here. And three, local.
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These are fiduciary marks or marks used to locate the position of an individual allowance pattern
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or component that may require more precision location such as a QFP.
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and again you can see that here in this image Pick and place types.
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Let's have a look at the chip shooter type.
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Now chip shooters are generally fast.
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They can range between 20 ,000 and 80 ,000 placements per hour
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and can even range up to 100 ,000 placements per hour with relatively low accuracy, generally in a range of 70 microns.
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As a result, chip shooters are not generally used for placing a active components which require better accuracy.
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There are three major types of chip shooters Stationary turret overhead gantry and revolver head.
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You can see an example of a chip shooter in this picture here.
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Let's have a look at a flexible placer type Now comparing to chip shooters, these are flexible places are slow.
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and they range between 6 ,000 to 40 ,000 placements per hour.
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But they have a high accuracy, as low as 25 microns.
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As a result, flexible placers are used to place complex and high I -O active components,
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such as QFPs, as high -performance I -O components generally require higher accuracy.
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There are three major types of flexible placer, Split axes.
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Thank you.
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Vacuum nozzles and grips.
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Let's have a look at vacuum nozzles.
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Vacuum nozzles are commonly used for handling all the components during the placement operations.
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There are a variety of vacuum nozzle sizes for different component sizes.
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For handling small components, positive pressure is often supplied in addition to vacuum at the moment of placement
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so that the component will be completely released from the nozzle.
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You can see a selection of vacuum nozzles in this image here.
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You can see the different sizes for the vacuum pickup.
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We also have mechanical grips.
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Self -centering mechanical grippers allow simultaneous pickup and automatic centering without a need for vacuum.
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A pair of tweezer type grippers would hold the part while centering it along one axis.
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Vision inspection.
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Upward facing vision system.
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The vision inspection part of the process checks the critical components have been picked correctly.
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their orientation and other features such as Pin 1 location.
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All of this data is then fed into the machine to
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ensure the device is placed into position with the highest accuracy possible.
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Inline Automated Optical Inspection or AOI.
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AOI is an automated visual inspection for printed circuit board manufacture
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where a camera autonomously scans the device under test for both catastrophic failure, in other words missing component,
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and quality defects such as fillet size or shape of component skew.
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And this is what that looks like.
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See the difference between these two.
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One is up facing and the other is down facing or in this case, top and bottom vision.
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Don't forget to check out our other videos in this PCB series
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and you can contact us if you need any help with your projects in China.
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So don't forget to like, share and subscribe to our channel.
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And if you hit this little bell symbol that will notify you of every new content that we upload.
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So thanks for listening, my name is Paul Adams and I shall see you in the next video.
📺 같은 채널
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이 레슨의 어휘와 말하기 포인트
이 C1 수준 말하기 레슨은 영상 “What is SMT (Surface Mount Technology)? PCB Assembly”을(를) 바탕으로 합니다. 가장 자주 반복되는 단어는 다음과 같습니다: component, Pcb, placement, board, solder. 이 영상에는 섀도잉할 문장 108개와 단어 1290개가 있습니다. 말하는 구간의 길이는 10:18입니다. 화자는 분당 약 125단어의 일정한 속도로 말해서 섀도잉하기에 편한 속도입니다. 영어에서 가장 많이 쓰이는 3,000단어에 속하는 단어가 72%뿐이라 어휘가 어려운 편입니다.
이 영상의 핵심 어휘
영상에서 가장 어려운 단어 15개를 발음, 뜻과 함께 정리했습니다.
| 단어 | 발음 | 뜻 |
|---|---|---|
| solder 명사 | /ˈsɒl.də(ɹ)/ | 땜납 |
| pasta 명사 | /ˈpɑ.stə/ | 파스타 |
| stencil 명사 | /ˈstɛnsəl/ | 스텐실, 템플렛 |
| vacuum 명사 | /ˈvæ.kjuːm/ | 진공 |
| squeegee 명사 | /ˈskwiˌd͡ʒi/ | 고무래 |
| shooter 명사 | /ˈʃuːtəː/ | 사수 |
| automate 동사 | /ˈɔ.təˌmeɪt/ | 자동화하다 |
| micron 명사 | /ˈmaɪkɹɒn/ | 미크론 |
| defect 명사 | /ˈdiːfɛkt/ | 결함 |
| soda 명사 | /ˈsoʊdə/ | 소다, 탄산 나트륨 |
| revolver 명사 | /ɹɪˈvɒl.vɚ/ | 리볼버 |
| serviceman 명사 | 군인 | |
| simultaneous 형용사 | /ˌsaɪ̯.məlˈteɪ̯.ni.əs/ | 동시적인 |
| parameter 명사 | /pəˈɹæm.ə.tɚ/ | 파라미터, 매개변수 |
| catastrophic 형용사 | /ˌkætəˈstɹɑfɪk/ | 비참한 |
이 영상의 문법
화자가 가장 많이 쓰는 문형을 영상 속 실제 표현과 함께 정리했습니다.
| 문형 | 영상 속 표현 |
|---|---|
| “used to” used to + 동사 — 지금은 아닌 과거의 습관이나 상태 | used to locate |
| 수동태 be + 과거분사 — 누가 하는지보다 무슨 일이 일어나는지에 초점 | are mounted · is soldered · has been designed |
| 현재완료 have/has + 과거분사 — 과거의 일이 지금도 관련이 있을 때 | has become · has been designed · has completed |
주의할 발음
화자는 don't, we're, we'll 같은 축약형과 약화된 형태를 5번 사용합니다. 들리는 대로 짧게 발음하세요.
- “sh”와 “zh” 소리: shooter /ˈʃuːtəː/, fiducial /fəˈd(j)uːʃəl/, fiduciary /fəˈduːʃ.i.eɹ.i/, fabrication /fæbɹɪˈkeɪʃən/, measurable /ˈmɛʒəɹəbəl/
- 긴 단어 — 강세 위치에 주의: fiduciary /fəˈduːʃ.i.eɹ.i/, fabrication /fæbɹɪˈkeɪʃən/, measurable /ˈmɛʒəɹəbəl/, simultaneous /ˌsaɪ̯.məlˈteɪ̯.ni.əs/, parameter /pəˈɹæm.ə.tɚ/
한국어 화자가 어려워하는 소리:
- /f/ — ㅍ(/p/)으로 바꾸지 말고 윗니를 아랫입술에 대기: fiducial /fəˈd(j)uːʃəl/, fiduciary /fəˈduːʃ.i.eɹ.i/, defect /ˈdiːfɛkt/, fabrication /fæbɹɪˈkeɪʃən/, fillet /fɪˈleɪ/
- /v/ — ㅂ(/b/)과 구별하기: vacuum /ˈvæ.kjuːm/, revolver /ɹɪˈvɒl.vɚ/, scavenge /ˈskæv.ɪndʒ/, overhead /ˈəʊvəˌhɛd/
- /r/과 /l/ 구별하기: solder /ˈsɒl.də(ɹ)/, placer /ˈpleɪsə(ɹ)/, measurable /ˈmɛʒəɹəbəl/, revolver /ɹɪˈvɒl.vɚ/, reel /ˈɹiːl/
이 영상으로 연습하는 방법
- 먼저 말하지 않고 영상을 끝까지 듣고 모르는 단어를 적어 둡니다.
- 보통 속도로 한 문장씩 섀도잉하고, 화자의 리듬과 맞을 때까지 반복합니다.
- 자신의 목소리를 녹음해 원본과 비교하고, solder, pasta, stencil 같은 단어에 특히 주의합니다.
쉐도잉이란? 영어 실력을 빠르게 키우는 과학적 방법
쉐도잉(Shadowing)은 원래 전문 통역사 훈련을 위해 개발된 언어 학습 기법으로, 다언어 학자인 Dr. Alexander Arguelles에 의해 대중화된 방법입니다. 핵심 원리는 간단하지만 매우 강력합니다: 원어민의 영어를 들으면서 1~2초의 짧은 지연으로 즉시 소리 내어 따라 말하는 것——마치 '그림자(shadow)'처럼 화자를 따라가는 것입니다. 문법 공부나 수동적인 청취와 달리, 쉐도잉은 뇌와 입 근육이 동시에 실시간으로 영어를 처리하고 재현하도록 훈련합니다. 연구에 따르면 이 방법은 발음 정확도, 억양, 리듬, 연음, 청취력, 말하기 유창성을 크게 향상시킵니다. IELTS 스피킹 준비와 자연스러운 영어 소통을 원하는 분들에게 특히 효과적입니다.