シャドーイング練習: What is SMT (Surface Mount Technology)? PCB Assembly (Part 1) - 動画で英語スピーキングを学ぶ

レッスンを作成中...
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Music Welcome to the next video in the series of PCBs.
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Here we're going to be looking at what is an SMT.
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So using a surface mount technology to assemble PCBs Part 1.
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Surface Mount Technology Overview.
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Now, Surface Mount Technology, which is the SMT, is a method for producing electrical circuits in which the components are mounted
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or placed directly onto the surface of printed circuit boards or PCBs.
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An electrical device that is soldered to the PCB is called a Surface Mount Device or an SMD for short.
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By employing SMT, the production process speeds up
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but the risk of defects also increases due to the component miniaturization and to the denser packing of boards.
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In these conditions, detection of failures has become critical for any SMT manufacturing process.
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Let's have a look at the PCBA production process.
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So manufacturing PCBs with SMA techniques.
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Manufacturing of printed circuit boards with an automated surface mount assembly,
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or SMA line, consists of the following sequence of operations.
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Solder paste application Component placement reflow soldering, cleaning and electrical test In this video,
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we will concentrate on the first two steps in this process.
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So we'll look at preassembly steps.
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So the PCB design and manufacture.
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Once the PCB has been designed and the components selected, it is time to get the PCB produced and the components ordered.
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PCBs that are populated on a serviceman assembly line are normally produced in panel formats, as shown on the right hand side here.
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The SMDs come packaged in different methods from trays for larger components and on tape bound on a reel for smaller components.
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All the SMDs need to be sourced and made ready to load into the manufacturing line machines.
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SodaPaste application Let's have a look at the solder paste application process.
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So once the PCB is loaded into the machine, the stencil is positioned over the panels.
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Solder paste is then added in front of the squeegee.
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Let's have a look at that in a diagram format.
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So we can see here the stencil is lowered onto the PCB, the squeegee is in position,
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and the solder paste loaded just before the squeegee.
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The squeegee lowers onto the stencil such that it is applying a very specific amount of pressure.
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The squeegee moves along the length of the stencil while the solder paste is deposited into the stencil apertures.
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And you can see that in this image here,
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where the squeegee has completed its journey and left the solder deposits in the stencil apertures.
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At the end of the travel, the squeegee raises up and the stencil is separated from the panels.
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That is depicted here in this image.
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You can see the stencil is raised leaving the soda paste on the correct positions on the pads.
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Solder paste issues.
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So this first one is the acceptable deposit onto a pad.
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This is what it should be looking like.
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Some of the issues that could follow are: Slumped deposit of solder paste onto the pad, which just looks like it's just dumped on.
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Scavenged deposits of solder, and this is where the middle has been scooped out, and you can see that here.
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Ridging is where a solid paste is connected between Two pads.
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The last one we're going to look at is peaking or dog ears effect.
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And you can see that depicted here.
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So component placement process Let's have a look at that in the PCB design and manufacture.
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So basic placement sequence generally includes board indexing,
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board registration, fiducial vision alignment, component pickup component centering or vision inspection,
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component placement and board indexing, and automated optical inspection, Component pickup.
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component centering and vision inspection, component placement are repeated for each component.
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And you can see an example of a component placed on the wet soda pads here.
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Thank you.
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Let's have a look at PCB positioning.
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and the PCB positioning method.
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Through the process of board indexing, The PCP is loaded to the appropriate position.
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Fiducial marks provide common measurable points for all steps in the assembly process.
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The three main types of fiduciary marks are: 1.
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Panel.
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This is a global fiducial mark on a multiple printed circuit board fabrication panel
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that are located outside the parameters of the end product printed circuit boards.
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You can see an example of that here.
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2. Global.
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These are fiduciary marks used to locate the position of all the features on an individual printed circuit port.
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Again, this is shown here. And three, local.
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These are fiduciary marks or marks used to locate the position of an individual allowance pattern
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or component that may require more precision location such as a QFP.
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and again you can see that here in this image Pick and place types.
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Let's have a look at the chip shooter type.
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Now chip shooters are generally fast.
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They can range between 20 ,000 and 80 ,000 placements per hour
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and can even range up to 100 ,000 placements per hour with relatively low accuracy, generally in a range of 70 microns.
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As a result, chip shooters are not generally used for placing a active components which require better accuracy.
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There are three major types of chip shooters Stationary turret overhead gantry and revolver head.
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You can see an example of a chip shooter in this picture here.
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Let's have a look at a flexible placer type Now comparing to chip shooters, these are flexible places are slow.
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and they range between 6 ,000 to 40 ,000 placements per hour.
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But they have a high accuracy, as low as 25 microns.
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As a result, flexible placers are used to place complex and high I -O active components,
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such as QFPs, as high -performance I -O components generally require higher accuracy.
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There are three major types of flexible placer, Split axes.
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Thank you.
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Vacuum nozzles and grips.
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Let's have a look at vacuum nozzles.
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Vacuum nozzles are commonly used for handling all the components during the placement operations.
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There are a variety of vacuum nozzle sizes for different component sizes.
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For handling small components, positive pressure is often supplied in addition to vacuum at the moment of placement
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so that the component will be completely released from the nozzle.
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You can see a selection of vacuum nozzles in this image here.
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You can see the different sizes for the vacuum pickup.
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We also have mechanical grips.
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Self -centering mechanical grippers allow simultaneous pickup and automatic centering without a need for vacuum.
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A pair of tweezer type grippers would hold the part while centering it along one axis.
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Vision inspection.
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Upward facing vision system.
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The vision inspection part of the process checks the critical components have been picked correctly.
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their orientation and other features such as Pin 1 location.
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All of this data is then fed into the machine to
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ensure the device is placed into position with the highest accuracy possible.
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Inline Automated Optical Inspection or AOI.
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AOI is an automated visual inspection for printed circuit board manufacture
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where a camera autonomously scans the device under test for both catastrophic failure, in other words missing component,
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and quality defects such as fillet size or shape of component skew.
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And this is what that looks like.
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See the difference between these two.
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One is up facing and the other is down facing or in this case, top and bottom vision.
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Don't forget to check out our other videos in this PCB series
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and you can contact us if you need any help with your projects in China.
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So don't forget to like, share and subscribe to our channel.
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And if you hit this little bell symbol that will notify you of every new content that we upload.
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So thanks for listening, my name is Paul Adams and I shall see you in the next video.

このレッスンの語彙とスピーキングのポイント

このC1レベルのスピーキングレッスンは、動画「What is SMT (Surface Mount Technology)? PCB Assembly」を教材にしています。 繰り返し出てくる語は次のとおりです:component, Pcb, placement, board, solder。 この動画には、シャドーイング用の文が108文、単語が1290語あります。 音声の長さは10:18です。 話す速さは1分あたり約125語で安定しており、シャドーイングしやすいペースです。 英語の頻出3,000語に含まれる単語は72%だけなので、語彙は難しめです。

この動画の重要語彙

動画の中で特に難しい単語15語を、発音と意味つきで紹介します。

単語発音意味
solder 名詞/ˈsɒl.də(ɹ)/半田
pasta 名詞/ˈpɑ.stə/パスタ
stencil 名詞/ˈstɛnsəl/ステンシル, テンプレート
vacuum 名詞/ˈvæ.kjuːm/真空
squeegee 名詞/ˈskwiˌd͡ʒi/スクイージー, スキージー
nozzle 名詞/ˈnɒzəl/ノズル
shooter 名詞/ˈʃuːtəː/射手
automate 動詞/ˈɔ.təˌmeɪt/自動化する
pad 名詞/pæd/パッド
aperture 名詞/ˈæp.ɚˌt͡ʃʊɹ/隙間
depict 動詞/dɪˈpɪkt/描く
micron 名詞/ˈmaɪkɹɒn/ミクロン
defect 名詞/ˈdiːfɛkt/欠陥, 欠点
soda 名詞/ˈsoʊdə/ソーダ, 炭酸ナトリウム
revolver 名詞/ɹɪˈvɒl.vɚ/リボルバー

動画に出てくる句動詞

単語発音意味
check out 動詞試験する, 検査する
speed up 動詞/spiːdˈʌp/スピードを出す

この動画の文法

話し手がよく使っている文型を、動画の実際の表現とともに紹介します。

文型動画での表現
「used to」 used to + 動詞 — 今はもう違う過去の習慣や状態used to locate
受動態 be + 過去分詞 — 誰がするかより、何が起きるかに焦点を当てるare mounted · is soldered · has been designed
現在完了形 have/has + 過去分詞 — 過去の出来事が今も関係しているhas become · has been designed · has completed

注意したい発音

話し手はdon't, we're, we'llなど、短縮形や弱形を5回使っています。聞こえたとおりの短い形で発音しましょう。

  • 「sh」と「zh」の音: shooter /ˈʃuːtəː/, fiducial /fəˈd(j)uːʃəl/, fiduciary /fəˈduːʃ.i.eɹ.i/, fabrication /fæbɹɪˈkeɪʃən/, measurable /ˈmɛʒəɹəbəl/
  • 長い単語(アクセントの位置に注意): fiduciary /fəˈduːʃ.i.eɹ.i/, fabrication /fæbɹɪˈkeɪʃən/, measurable /ˈmɛʒəɹəbəl/, simultaneous /ˌsaɪ̯.məlˈteɪ̯.ni.əs/, parameter /pəˈɹæm.ə.tɚ/

日本語話者が苦手な音:

  • /r/ と /l/ の区別 — /l/ は舌先を歯茎につけ、/r/ はどこにもつけない: solder /ˈsɒl.də(ɹ)/, placer /ˈpleɪsə(ɹ)/, measurable /ˈmɛʒəɹəbəl/, revolver /ɹɪˈvɒl.vɚ/, reel /ˈɹiːl/
  • /v/ — /b/ にならないように、上の歯を下唇に当てる: vacuum /ˈvæ.kjuːm/, revolver /ɹɪˈvɒl.vɚ/, scavenge /ˈskæv.ɪndʒ/, overhead /ˈəʊvəˌhɛd/
  • /f/ — 「フ」ではなく、上の歯と下唇で出す: fiducial /fəˈd(j)uːʃəl/, fiduciary /fəˈduːʃ.i.eɹ.i/, defect /ˈdiːfɛkt/, fabrication /fæbɹɪˈkeɪʃən/, fillet /fɪˈleɪ/

この動画での練習方法

  1. まず声を出さずに動画を最後まで聞き、知らない単語をメモします。
  2. 通常の速度で一文ずつシャドーイングし、話し手のリズムに合うまで繰り返します。
  3. 自分の声を録音して元の音声と比べます。solder, pasta, stencilなどの単語に特に注意しましょう。

シャドーイングとは?英語上達に効果的な理由

シャドーイング(Shadowing)は、もともとプロの通訳者養成プログラムで開発された言語学習法で、多言語習得者として知られるDr. Alexander Arguelles によって広く普及されました。方法はシンプルですが非常に効果的:ネイティブスピーカーの英語を聞きながら、1〜2秒の遅延で声に出してすぐに繰り返す——まるで「影(shadow)」のように話者を追いかけます。文法ドリルや受動的なリスニングと異なり、シャドーイングは脳と口の筋肉が同時にリアルタイムで英語を処理・再現することを強制します。研究により、発音精度、抑揚、リズム、連音、リスニング力、そして会話の流暢さが大幅に向上することが確認されています。IELTSスピーキング対策や自然な英語コミュニケーションを目指す方に特におすすめです。

シャドーイングのやり方: ステップ別の完全ガイドを読む →