ฝึกพูดภาษาอังกฤษด้วยเทคนิค Shadowing จากวิดีโอ: A Brief History of Semiconductor Packaging
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In this video, we're going to look at a brief history of the semiconductor packaging industry.
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Packaging refers to the integrated circuits, carrier, and enclosure.
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It protects the silicon dye inside from physical damage while also allowing it to be connected to other devices.
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The industry has long been chopped liver, overshadowed by the sexier work of wafer fabrication.
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But it's important and we should know about it.
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Let's go.
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But first, let me talk about the Asianometry Patreon.
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Early Access members see new videos and selected references for them before the release of the public.
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It helps support the videos and I appreciate every pledge.
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Thanks, and on with the show.
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ICs are precious little snowflakes.
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They need protection from the real world, which is full of damaging influences.
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Particles can get in and interfere with operations.
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Moisture in the air can cause their metals to corrode.
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High temperatures generated during operations can cause the IC to degrade or even fail outright.
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Vibrations or jolts can damage the chip's capabilities.
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And so on.
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The packaging is for protecting from all of these threats.
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Let's talk about what's inside.
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First, we have your die.
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The die attaches to a metal support called a lead frame.
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Oftentimes through the use of clips, adhesive or straps.
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The lead frame has wires attached to it which connected to the outside world.
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These are called bond wires.
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And then finally, there is a plastic or ceramic or metal enclosure surrounding the die, the lead frame, and the bond wires.
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This whole setup is considered by the industry as only the first level of semiconductor packaging.
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The second level refers to the circuit board, and the third and final level refers to the system's final enclosure, like the desktop PC's chassis.
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The process of encasing the fabricated die into its level 1 package is referred to as the back -end.
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We can further break down back -end processes to two major steps, assembly and test.
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Processes differ based on the technology, but here is the vanilla workflow.
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In assembly, we start by cutting the dies out of the completed wafer and inspecting them.
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After this, we have to put the dies onto the package's lead frame, called die attach or die bonding or die mounting.
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Then we attach the very small bond wires to the dies which allow the chip to communicate with the outside world.
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This step is called wire bonding and was pioneered by Bell Labs in the 1950s.
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After that, we put the die into its ceramic or plastic package to protect it from the outside world.
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At the start, this process had to be done manually, making it one of the first things to be outsourced abroad.
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Since then, machines have taken over and a swath of new bonding techniques have been introduced.
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Discussing them is beyond the scope of this video, but you should know they exist.
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Throughout its history, packaging's goals have stayed rather consistent.
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Help the IC achieve its full functionality and don't get in its way, be as small as possible, and be as cost -effective as possible.
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In the beginning, only military or aerospace companies used semiconductors.
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Price was less of a concern than total reliability.
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Ergo, most semiconductor manufacturers packaged their dies in hermetically sealed cans made out of ceramic or steel.
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This prevented any contaminants from messing with the chip, but there were serious drawbacks.
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Ceramics and metal cost a lot.
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They were also heavy, which meant that the circuit boards they were attached to had to support all that weight.
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This made them heavy, too.
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Packaging took a big leap forward with, who else, Fairchild Semiconductor.
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When Fairchild started producing their revolutionary planar ICs in the late 1950s,
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they packed them in the same TO5 and flat pack packages they used for transistors, just with a few more leads.
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We will talk about flat packs a little later in this video.
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But first, let us talk about the TO5.
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The TO stands for Transistor Outline.
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A TO5 kind of looks like a squid.
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Basically a metal can and metal lid.
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Fairchild's first micrologic chips were accordingly etched in a round shape.
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But the TO5's awkward round shape made it difficult to attach onto and arrange on a board, adding to the labor cost.
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Worse yet, TO5's limited how much data the chip can take in and push out.
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They maxed out at just 8 -10 pins.
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Fairchild's new logic circuits needed far more than that.
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To5 packaging diluted the IC's advantages and worsened its disadvantages.
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With this situation, how were ICs ever going to get to price parity with germanium devices and vacuum tubes?
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In response, Fairchild developed two new packaging techniques.
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The first was plastic encapsulation.
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It sounds fancy, but the way they did it back then was to put the IC die on a ceramic bead
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and cover the whole thing with a plastic blob.
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This method had some issues.
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Plastic can be permeable to certain chemicals, leading to concern surrounding contamination.
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And plastic can shrink or grow, depending on outside conditions like heat, inflicting mechanical stress on the chips inside.
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However, plopping plastic onto a chip required very little skill.
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This meant that Fairchild could outsource his assembly work to cheap manual labor in Hong Kong or South Korea.
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One of the first such electronics companies to do so.
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Fairchild's second idea would forever change semiconductor packaging.
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Fairchild's digital systems laboratory head, Rex Rice, created a new lead configuration for an IC.
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The leads were spaced about one hundred thousandths of an inch apart.
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The industry term for this measurement is lead pitch and came out in a single line.
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You would attach the package to the circuit board using what is called through -hole mounting.
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Here, you insert the package's leads through literal holes drilled into the boards.
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The holes have large round solder contact areas surrounding them.
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After insertion, you solder the leads on the backside to secure them.
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The method for doing this was called wave soldering.
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Tests found that this new inline packaging system fit all the criteria.
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It can accommodate more I .O some 12 to 16 pins at the start.
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It simplified the circuit board layout.
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And finally, it took less time and skill to assemble.
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The inline arrangement was far simpler than the TO5CAN's circle -shaped leads.
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Before deploying the product, Fairchild first consulted with customers and end users who did not like the single line arrangement.
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However, they would be okay with two lines.
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So Fairchild revised the prototype to two rows of inline pins.
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Dual inline packaging or DIP.
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Introduced in 1965, the simplicity of dual inline packaging cut the cost of assembly by a factor of four.
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The industry widely adopted it throughout the 1970s and 80s.
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During those 20 years, DIPs held some 80 -90 % market share when measured by value.
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However, as the industry moved into the 1970s and the era of very large -scale integration or VLSI, demands for I -O density kept growing.
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Some VLSI chips would require as many as 300 leads.
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More leads forced the DIPs to grow increasingly large.
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DIPs can have 64 or even more leads, but doing so gave them impractically large board footprints.
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If trends continued the way they were, the DIP packages would end up being far larger than the dyes themselves.
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This invalidates the various miniaturization gains in semiconductor manufacturing.
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In response to this trend, a series of new packages capable of accommodating far more leads emerged.
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The packaging industry's second big revolution.
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This generation of packages was defined not by their shape, but rather how they were attached to the circuit board.
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Surface mounting technology describes a style of mounting packages onto the board using flat patches of solder already on the board.
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Surface mounting had several advantages over through -hole mounting.
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First, because through -hole mounting required you to solder the back side of the boards to secure the DIPs,
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you can only use one side of the board.
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With surface mounting, you can use both.
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This alone increases the theoretical number of packages on a single board by 35 -60%.
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Second, it allowed us to move the leads closer together.
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Or in other words, for a smaller lead pitch.
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This is because you no longer have the solder contact areas around the holes.
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And third, you can use cheaper boards.
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Drilling a hole into a board costs money.
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And there can be up to a thousand holes on a standard board.
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Contemporary estimates found that a surface mount board costs $0 .13 per square inch, while an insertion hole mounting board costs $0 .15.
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Furthermore, the boards aren't peppered with holes anymore, which means they don't need so many layers to maintain their structural integrity.
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Another cost -saving measure.
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Previously all that surface mounting had to be done by hand.
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Which, considering the smaller lead pitches, required a great deal of skill and training.
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This was the primary reason why surface mounting didn't take off at first.
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New automatic machines finally closed the loop on this.
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Manufacturers now use convection heating, hot gas or even infrared heat rays to solder the packages onto the boards.
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Basically ovens.
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The origins of modern surface mounting technology are murky.
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And there isn't one significant inventor or eureka moment.
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I mean, the concept of attaching stuff to a board is not exactly groundbreaking.
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The earliest credible mention is a British patent filed in 1960.
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It describes resistors, coils, and such attached to a printed board using an adhesive.
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The connectors were connected using solder.
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Early adopters in the 1960s included the US military, which used flatpacks for their missile guidance computers.
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The flatpak was a stackable rectangular glass and ceramic package that was surface mounted onto a board.
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The flat pack was invented in 1962 by Yong Tao of Texas Instruments.
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So actually a few years older than the venerable DIP.
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I couldn't find much more about inventor Yong Tao or his life, which is unfortunate.
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In the late 1960s, the Swiss watch industry adopted surface mounting as a way to reduce the number of electronics in their watches.
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They popularized what is called the Small Outline integrated circuit, sometimes also known as the Swiss outline.
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The small outline looks like the DIP and is made from the same molded plastic materials.
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However, it is far smaller.
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A third as high and half as long.
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This was because its 28 gull -wing leads are spaced far closer together.
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Possible again because we are directly mounting these onto the board.
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They are called gull -wing leads because their shape is somewhat reminiscent of seagull's wings.
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Seagulls are birds that steal your hot dogs at the beach.
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In the 1970s, the Japanese electronics industry began adopting surface mounting technology for their car radios, TV tuners, and TV cameras.
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It is likely they got the idea from Europe, Germany, or Britain perhaps.
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By the 1978 and 1980 period,
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the semiconductor packaging industry had started moving towards surface mounting with numerous published articles discussing its use for increasing packing density. In the early 1980s,
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the Japanese revived the old US military flat pack to create
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an updated surface mount compatible version called the Quad Flat Package or QFP.
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With the Quad Flat, we have the leads projecting down and away from all four sides of the square package.
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Depending on their size, the quad -flat can offer anywhere from 20 to 240 leads.
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Pitches shrank to as small as 1 or 0 .65 millimeters.
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You can go guess how many inches that is.
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The quad -flat quickly evolved.
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Pushed along by consumer demands for smaller and smaller consumer electronics, the Japanese industries introduced yet smaller packages like the shrink quad flat package,
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the very small quad flat package, and the thin quad flat package.
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On the other end of the spectrum, new structures outpaced the quad flat on the lead count front.
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People realized that having the leads come out of the sides meant
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that you couldn't use the real estate underneath the package itself.
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So for high lead count devices, the packaging industry revived an old IBM invention, the pin grid array or the PGA.
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First introduced in 1971, the square -shaped pin grid array can handle hundreds of leads on its underside.
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IBM invented the pin grid array for high IO uses in the computer industry.
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Those packages were made from ceramic, which not only made them more expensive but also their circuit boards,
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since those boards had to get thicker to handle the added weight.
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Plastic variants were later introduced.
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Pin grid arrays were invented before the surface mount revolution.
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So a surface mount compatible cousin emerged in the 1980s.
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The ball grid array.
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With these, solder balls are used rather than pins to connect the chip to the circuit board.
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One big disadvantage of the ball grid was that you could not easily visually inspect the solder connections underneath the package.
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X -ray and electrical tests are often used instead, with badly soldered packages removed, reballed, and reapplied.
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Solder ball technology appear in another packaging innovation that popularized at about the same time as the BGA, flip chip.
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This is where the silicon die is flipped so that it faces downwards.
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To build the interconnects, we ditch wire bonding entirely in connect using bumps and balls on the chip's pads.
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Flip chip technology is still used today and offers several benefits.
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First, there is more contact with a heat sink, which dissipates more heat.
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Second, electrical signals have a shorter distance with flip chip interconnects than bond wires.
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Starting in the 1990s, consumers started buying smaller electronics like mobile phones.
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Smaller devices mean smaller components, chips, and packages.
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Space became a premium in a chip package.
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The industry measures this using what is called packaging efficiency, the ratio of the area occupied by the active device.
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the dye.
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In response to this, the packaging industry developed the Chipscale package, which entered the market in the mid -1990s.
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Chipscale packaging is an evolution of the aforementioned ball grid array
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and refers to any package where the bare dye occupies 80 % or more of the total package area.
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Taiwanese OSAT vendors like ASE Group rose up on the back of such ultra compact packages.
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One prominent implementation of this concept is called wafer -level packaging.
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This is where we hook up all the die interconnects before we cut those dies out of the wafer.
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It's not only very cost -effective, but gives you very small packages.
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As I mentioned earlier, the advent of surface mounting technology created a new generation of packages and techniques.
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As Moore's Law slows down, packaging technologies have seen yet another surge of investment, creating what we can call advanced packaging solutions.
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These new packaging technologies now have a much more direct role to play in the system's overall performance.
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Semi -analysis has a fantastic multi -part breakdown on advanced packaging that I think drops the mic on the subject.
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Perhaps the most well -known of these are chiplets.
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This is a variant of what are called multi -chip modules or hybrid circuits or system in packages.
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I did a video about it previously.
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Most prominently, AMD used them to create a disruptively great product.
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One special area of the multi -chip worlds involves 2 .5D and 3D integration.
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These are especially cool.
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2 .5D integration is where we put multiple dies side -by -side on top of an interconnect substrate called a silicon interposer.
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This silicon interposer doesn't have any logic, but is just made up of many embedded interconnects.
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There are a few consumer products using 2 .5D integration today.
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For instance, AMD's Radeon R9 Fury GPU first introduced in 2015.
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As the name implies, 2 .5D is an intermediate step towards 3D packaging, stacking and connecting multiple dies.
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We are now able to use a whole new dimension to achieve packaging efficiencies of over 100%.
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Connecting these dies may require something more heavy than your standard wire bonds, bringing forth new concepts like the through -silicon vias or TSVs.
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I am working on a future video on 3D integration and die stacking.
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So keep an eye out for that, If I ever finish it.
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The semiconductor packaging industry is truly a chaotic one.
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There are so many different technology trees growing concurrently with one another, each branch developing and splitting for a certain significant need.
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New technologies are built on top of those addressing particular niche applications,
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and then suddenly before you know it you have no idea why this new thing, which you saw fail a long time ago,
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is now such a big deal all over again.
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In the semiconductor packaging world, ideas are created and then vanish off the mainline, only to return to the forefront when their time is right.
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Expect more deep dives into semiconductor packaging in the near future as we familiarize ourselves with this new world.
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คำศัพท์และข้อสังเกตด้านการพูดสำหรับบทเรียนนี้
บทเรียนฝึกพูดนี้ใช้วิดีโอ “A Brief History of Semiconductor Packaging” เป็นสื่อ คำที่ถูกพูดซ้ำบ่อยที่สุด: package, packaging, board, lead, die วิดีโอนี้มี 215 ประโยค และ 2807 คำ สำหรับฝึกพูดตาม ช่วงที่มีเสียงพูดยาว 18:22 ผู้พูดพูดด้วยความเร็วเป็นธรรมชาติ ประมาณ 153 คำต่อนาที ใกล้เคียงกับบทสนทนาในชีวิตประจำวัน มีเพียง 73% ของคำที่อยู่ใน 3,000 คำที่ใช้บ่อยที่สุดในภาษาอังกฤษ คำศัพท์จึงค่อนข้างยาก
คำศัพท์สำคัญในวิดีโอนี้
คำที่ควรเรียนรู้ 15 คำจากวิดีโอ พร้อมคำอ่านและความหมาย:
| คำศัพท์ | คำอ่าน | ความหมาย |
|---|---|---|
| package คำนาม | /ˈpæk.ɪd͡ʒ/ | หีบห่อ, ห่อ |
| semiconductor คำนาม | /ˌsɛmikənˈdʌktə/ | สารกึ่งตัวนำ |
| wire คำนาม | /ˈwaɪɚ/ | ลวด, สาย |
| grid คำนาม | /ɡɹɪd/ | ตาราง |
| ceramic คำนาม | /səˈɹæmɪk/ | เซรามิก |
| electronics คำนาม | /ɪˌlɛkˈtɹɑ.nɪks/ | อิเล็กทรอนิกส์ |
| silicon คำนาม | /ˈsɪləˌkɑn/ | ซิลิคอน |
| pitch คำนาม | /pɪt͡ʃ/ | การขว้าง |
| connect คำกริยา | /kəˈnɛkt/ | เชื่อม, ต่อ |
| pin คำนาม | /pɪn/ | เข็มหมุด, เข็ม |
| attach คำกริยา | /əˈtæt͡ʃ/ | ติด |
| surround คำกริยา | /səˈɹaʊnd/ | ล้อม |
| invent คำกริยา | /ɪnˈvɛnt/ | คิดค้น |
| density คำนาม | /ˈdɛn.sə.ti/ | ความหนาแน่น |
| dual คำคุณศัพท์ | /ˈdul/ | ทวิพจน์ |
ไวยากรณ์ในวิดีโอนี้
โครงสร้างที่ผู้พูดใช้บ่อยที่สุด พร้อมคำพูดจริงจากวิดีโอ:
| โครงสร้าง | ในวิดีโอ |
|---|---|
| Passive voice be + กริยาช่อง 3 — เน้นสิ่งที่เกิดขึ้น ไม่ใช่ผู้กระทำ | be connected · been chopped · are called |
| Present perfect have/has + กริยาช่อง 3 — เหตุการณ์ในอดีตที่ยังเกี่ยวข้องกับปัจจุบัน | have taken · have stayed · have seen |
| Relative clauses who / which + อนุประโยค — ข้อมูลเพิ่มเติมเกี่ยวกับคนหรือสิ่งของ | world, which is · anymore, which means · life, which is |
การออกเสียงที่ควรระวัง
ผู้พูดใช้รูปย่อและรูปลดเสียง 9 ครั้ง เช่น couldn't, don't, aren't ให้พูดแบบสั้นตามที่ได้ยิน
- เสียง “th”: underneath /ˌʌndɚˈniθ/, thin /ˈθɪn/, furthermore /ˈfɜː(ɹ).ðə(ɹ)ˌmɔː(ɹ)/, theoretical /ˌθi.əˈɹɛt.ɪ.kəl/
- เสียง “sh” และ “zh”: integration /ˌɪn.tɪˈɡɹeɪ.ʃən/, enclosure /ɛnˈkloʊʒəɹ/, evolution /ˌiːvəˈluːʃ(ə)n/, efficiency /ɪˈfɪʃ.ən.si/, ratio /ˈɹeɪ.ʃoʊ/
- คำยาว — ลงเสียงหนักให้ถูกพยางค์: semiconductor /ˌsɛmikənˈdʌktə/, integration /ˌɪn.tɪˈɡɹeɪ.ʃən/, electronics /ɪˌlɛkˈtɹɑ.nɪks/, electrical /ɪˈlɛktɹɪkəl/, manufacturer /ˌmænjʊˈfæktʃəɹə/
เสียงที่คนไทยมักออกเสียงยาก:
- เสียงท้ายคำ — ออกเสียงให้ครบ ไม่เปลี่ยนเป็นตัวสะกดแบบไทย: package /ˈpæk.ɪd͡ʒ/, electronics /ɪˌlɛkˈtɹɑ.nɪks/, pitch /pɪt͡ʃ/, attach /əˈtæt͡ʃ/, skill /skɪl/
- /v/ — ไม่ใช่ /w/ ให้ฟันบนแตะริมฝีปากล่าง: invent /ɪnˈvɛnt/, revive /ɹɪˈvaɪ̯v/, inventor /ɪnˈvɛntɚ/, evolution /ˌiːvəˈluːʃ(ə)n/, innovation /ˌɪn.əˈveɪ.ʃən/
- /z/ — เสียงก้อง ไม่ใช่ /s/: cousin /ˈkʌz(ə)n/, revise /ɹɪˈvaɪz/
วิธีฝึกกับวิดีโอนี้
- ฟังวิดีโอให้จบหนึ่งรอบโดยยังไม่ต้องพูด แล้วจดคำที่ยังไม่รู้จัก
- เริ่มที่ความเร็ว 0.75× พูดตามทีละประโยค แล้วกลับไปใช้ความเร็วปกติเมื่อเริ่มคล่อง
- อัดเสียงตัวเองแล้วเทียบกับต้นฉบับ โดยสังเกตคำอย่าง package, semiconductor, wire เป็นพิเศษ
เทคนิค Shadowing คืออะไร?
Shadowing เป็นเทคนิคการเรียนรู้ภาษาที่ได้รับการรับรองทางวิทยาศาสตร์ พัฒนาขึ้นสำหรับการฝึกนักแปลมืออาชีพ วิธีการนี้เรียบง่ายแต่ทรงพลัง: คุณฟังเสียงภาษาอังกฤษจากเจ้าของภาษาและพูดตามทันที — เหมือนเงาที่ตามผู้พูดด้วยช่วงเวลาห่าง 1-2 วินาที การวิจัยแสดงว่าเทคนิคนี้ปรับปรุงความแม่นยำในการออกเสียง ทำนองเสียง จังหวะ การเชื่อมเสียง การฟังเข้าใจ และความคล่องแคล่วในการพูดได้อย่างมีนัยสำคัญ